Introduction
This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra-thin fabric to increase resistance and workability of punching, strip type, Malformation designs. Self-adhesive and never recede. No corrosion to the Copper surface, “enviromentally friendly products”.
Features
Thermal conductivity 1.2~3.0w/m·k
Ultra conformable,“gel-like” modulus
Designed for low-stress applications
low hardness
Applications
Electric vehicle battery pack
Telecommunications
Computer, Between heat-generating semiconductor and a heat sink
