Product Description

Introduction

This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra-thin fabric to increase resistance and workability of punching, strip type, Malformation designs. Self-adhesive and never recede. No corrosion to the Copper surface, “enviromentally friendly products”.

 

Features

Thermal conductivity 1.2~3.0w/m·k

Ultra conformable,“gel-like” modulus

Designed for low-stress applications

low hardness

 

Applications

Electric vehicle battery pack

Telecommunications

Computer, Between heat-generating semiconductor and a heat sink

 

 

 

 

 

Payment Terms︰ T/T